AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute ...

As transistor sizes shrink to their atomic limits, computing demands are only growing. Sending chips to the third dimension is the future: Chips stacked on other chips can get more work done in the ...

Artificial intelligence is rapidly shifting from the cloud to the devices we use every day. The first wave of generative AI ...

The AI boom doesn't run on GPUs. It runs on a 12-layer tower of memory, and here's why that monopoly is now setting the price ...

Intel is undergoing a massive transformation into a premier domestic foundry powerhouse driven by heavy government backing ...

Stacker compiled data on all spy films to develop a Stacker score—a weighted index split evenly between IMDb and Metacritic scores. Here are the best.

GlobalFoundries (Nasdaq: GFS) (GF) today announced the production readiness of its SLATE™ wafer-to-wafer bonding technology on its industry-leading 9SW radio-frequency silicon-on-insulator (RF-SOI) ...

IBM says it can fit nearly 100 billion transistors on a chip - why the milestone matters ...

GlobalFoundries (GF) has confirmed that its SLATE wafer-to-wafer bonding technology has reached production readiness on the ...

In failure analysis the problem is not lack of data but that most of it never reaches the engineers who need it most.

On May 24, CNBC reported that AI developers are now increasingly turning to photonics to fix data transfer bottlenecks between chips and systems, noting the technology uses light instead of ...

Intel Corp. has broken ground on an expansion of its Santa Clara, California, facility that will include semiconductor ...